Inventor

SENEVIRATNE DILAN

US38 patents

⚠️ This page may combine multiple inventors who share the name “SENEVIRATNE DILAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SENEVIRATNE DILAN

INTEL CORP

Fabricating an RF filter on a semiconductor package using selective seeding

Panel with releasable core

Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same

Surface finishes with low rBTV for fine and mixed bump pitch architectures

Panel with releasable core

Semiconductor packages with embedded interconnects

Bendable and stretchable electronic devices and methods

Bumpless build-up layer package including a release layer

Embedded circuit patterning feature selective electroless copper plating

Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives

Fabricating an RF filter on a semiconductor package using selective seeding

Dielectric film with pressure sensitive microcapsules of adhesion promoter

Package-integrated vertical capacitors and methods of assembling same

Embedded die microelectronic device with molded component

Package-integrated vertical capacitors and methods of assembling same

Embedded die microelectronic device with molded component

Surface finishes with low RBTV for fine and mixed bump pitch architectures

Microelectronic assemblies having conductive structures with different thicknesses

Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same

Electronic package that includes lamination layer

Method for making a flexible wearable circuit

Semiconductor packages with embedded interconnects

Glass dielectric layer with patterning

Flexible packaging for a wearable electronic device

Optical waveguide formed within in a glass layer

Build-up high-aspect ratio opening

Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby

Formation of dielectric with smooth surface

Stretchable electronic assembly

Selective deposition of embedded thin-film resistors for semiconductor packaging

Raster-planarized substrate interlayers and methods of planarizing same

Multilayer substrate for semiconductor packaging

Selective metallization of an integrated circuit (IC) substrate

Embedded circuit patterning feature selective electroless

Flexible microelectronic systems and methods of fabricating the same

BOYAPATI SRI RANGA SAI

Package with passivated interconnects

SENEVIRATNE DILAN

Embedded architecture using resin coated copper

MALATKAR PRAMOD

Microelectronic package and stacked microelectronic assembly and computing system containing same