Inventor

FON BIH WEN

MY3 patents

⚠️ This page may combine multiple inventors who share the name “FON BIH WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMICONDUCTOR COMPONENTS IND

2 patents

US9281258B1Mar 8, 2016

Chip scale packages and related methods

SEMICONDUCTOR COMPONENTS IND6 citations69

US9018044B2Apr 28, 2015

Chip-on-lead package and method of forming

SEMICONDUCTOR COMPONENTS IND0 citations45

PRAJUCKAMOL ATAPOL

1 patent

US8759978B2Jun 24, 2014

Chip-on-lead package and method of forming

PRAJUCKAMOL ATAPOL4 citations61