P

Inventor

HATANO TATSUO

JP55 patents
⚠️ This page may combine multiple inventors who share the name “HATANO TATSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOKYO ELECTRON LTD

38 patents
US5709757AJan 20, 1998

Film forming and dry cleaning apparatus and method

TOKYO ELECTRON LTD160 citations99
US5989345ANov 23, 1999

Process-gas supply apparatus

TOKYO ELECTRON LTD108 citations98
US5595606AJan 21, 1997

Shower head and film forming apparatus using the same

TOKYO ELECTRON LTD1,174 citations98
US5690743ANov 25, 1997

Liquid material supply apparatus and method

TOKYO ELECTRON LTD79 citations96
US5963834AOct 5, 1999

Method for forming a CVD film

TOKYO ELECTRON LTD62 citations94
US6126994AOct 3, 2000

Liquid material supply apparatus and method

TOKYO ELECTRON LTD16 citations92
US5954887ASep 21, 1999

Cleaning processing method of a film forming apparatus

TOKYO ELECTRON LTD43 citations92
US5704214AJan 6, 1998

Apparatus for removing tramp materials and method therefor

TOKYO ELECTRON LTD28 citations92
US11764092B2Sep 19, 2023

Substrate transfer apparatus and substrate processing system

TOKYO ELECTRON LTD6 citations86
US8029873B2Oct 4, 2011

Film deposition method and film deposition apparatus of metal film

TOKYO ELECTRON LTD7 citations84
US7790626B2Sep 7, 2010

Plasma sputtering film deposition method and equipment

TOKYO ELECTRON LTD8 citations84
US12211720B2Jan 28, 2025

Vacuum transfer device, substrate processing system, and substrate processing method

TOKYO ELECTRON LTD3 citations75
US12183612B2Dec 31, 2024

Substrate transfer apparatus, substrate transfer method, and substrate processing system

TOKYO ELECTRON LTD4 citations75
US11990357B2May 21, 2024

Substrate transport apparatus, substrate transport method, and substrate processing system

TOKYO ELECTRON LTD3 citations75
US7427426B2Sep 23, 2008

CVD method for forming metal film by using metal carbonyl gas

TOKYO ELECTRON LTD6 citations74
US6169032B1Jan 2, 2001

CVD film formation method

TOKYO ELECTRON LTD11 citations74
US6153515ANov 28, 2000

Method of forming multilayered film

TOKYO ELECTRON LTD14 citations74
US9576850B2Feb 21, 2017

Method for manufacturing semiconductor device

TOKYO ELECTRON LTD2 citations73
US6080444AJun 27, 2000

CVD film forming method including annealing and film forming performed at substantially the same pressure

TOKYO ELECTRON LTD11 citations72
US11602856B2Mar 14, 2023

Vacuum transfer device and substrate processing system

TOKYO ELECTRON LTD0 citations63
US8349283B2Jan 8, 2013

Metal recovery method, metal recovery apparatus, gas exhaust system and film forming device using same

TOKYO ELECTRON LTD4 citations63
US8026176B2Sep 27, 2011

Film forming method, plasma film forming apparatus and storage medium

TOKYO ELECTRON LTD6 citations63
US7491430B2Feb 17, 2009

Deposition method for forming a film including metal, nitrogen and carbon

TOKYO ELECTRON LTD5 citations63
US5880526AMar 9, 1999

Barrier metal layer

TOKYO ELECTRON LTD6 citations63
US12033878B2Jul 9, 2024

Substrate transfer apparatus and substrate processing system

TOKYO ELECTRON LTD0 citations62
US10189230B2Jan 29, 2019

Method for forming copper film

TOKYO ELECTRON LTD1 citations62
US7063871B2Jun 20, 2006

CVD process capable of reducing incubation time

TOKYO ELECTRON LTD4 citations62
US12428721B2Sep 30, 2025

Film forming apparatus and film forming method

TOKYO ELECTRON LTD0 citations52
US12327744B2Jun 10, 2025

Substrate transfer device and substrate processing system

TOKYO ELECTRON LTD0 citations52
US11404255B2Aug 2, 2022

Sputtering method and sputtering apparatus

TOKYO ELECTRON LTD0 citations52
US11251027B2Feb 15, 2022

Stage device and processing apparatus

TOKYO ELECTRON LTD0 citations52
US10910215B2Feb 2, 2021

Method of forming later insulating films for MTJ

TOKYO ELECTRON LTD0 citations52
US10068798B2Sep 4, 2018

Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrate

TOKYO ELECTRON LTD1 citations52
US9976217B2May 22, 2018

Film forming method using reversible decomposition reaction

TOKYO ELECTRON LTD1 citations52
US9362167B2Jun 7, 2016

Method of supplying cobalt to recess

TOKYO ELECTRON LTD1 citations52
US9064690B2Jun 23, 2015

Method for forming Cu wiring

TOKYO ELECTRON LTD0 citations52
US7879399B2Feb 1, 2011

CV method using metal carbonyl gas

TOKYO ELECTRON LTD0 citations52
US7344754B2Mar 18, 2008

Film formation method

TOKYO ELECTRON LTD1 citations52

IBM

3 patents

ISHIZAKA TADAHIRO

3 patents

KOJIMA YASUHIKO

2 patents

GOMI ATSUSHI

2 patents

CENTRAL GLASS CO LTD

1 patent

HARA MASAMICHI

1 patent

Showing the top 50 of 55 patents by PatentIndex Score.