Inventor
SEO SOON-CHEON
US179 patents
⚠️ This page may combine multiple inventors who share the name “SEO SOON-CHEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
42 patentsUS6503834B1Jan 7, 2003
Process to increase reliability CuBEOL structures
IBM79 citations98
US6573606B2Jun 3, 2003
Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect
IBM307 citations97
US10297668B1May 21, 2019
Vertical transport fin field effect transistor with asymmetric channel profile
IBM18 citations94
US10115800B1Oct 30, 2018
Vertical fin bipolar junction transistor with high germanium content silicon germanium base
IBM17 citations94
US9397006B1Jul 19, 2016
Co-integration of different fin pitches for logic and analog devices
IBM25 citations94
US9330983B1May 3, 2016
CMOS NFET and PFET comparable spacer width
IBM18 citations93
US9431486B1Aug 30, 2016
Channel strain and controlling lateral epitaxial growth of the source and drain in FinFET devices
IBM13 citations92
US10804165B2Oct 13, 2020
Source and drain isolation for CMOS nanosheet with one block mask
IBM12 citations86
US10325820B1Jun 18, 2019
Source and drain isolation for CMOS nanosheet with one block mask
IBM14 citations86
US10672872B1Jun 2, 2020
Self-aligned base contacts for vertical fin-type bipolar junction transistors
IBM9 citations84
US10396126B1Aug 27, 2019
Resistive memory device with electrical gate control
IBM11 citations84
US10381074B1Aug 13, 2019
Differential weight reading of an analog memory element in crosspoint array utilizing current subtraction transistors
IBM10 citations84
US10347456B1Jul 9, 2019
Vertical vacuum channel transistor with minimized air gap between tip and gate
IBM8 citations84
US10347739B2Jul 9, 2019
Extended contact area using undercut silicide extensions
IBM5 citations84
US10256296B2Apr 9, 2019
Middle-of-line (MOL) capacitance reduction for self-aligned contact in gate stack
IBM5 citations84
US10236362B2Mar 19, 2019
Nanowire FET including nanowire channel spacers
IBM10 citations84
US9887289B2Feb 6, 2018
Method and structure of improving contact resistance for passive and long channel devices
IBM6 citations84
US9871099B2Jan 16, 2018
Nanosheet isolation for bulk CMOS non-planar devices
IBM6 citations84
US9704760B2Jul 11, 2017
Integrated circuit (IC) with offset gate sidewall contacts and method of manufacture
IBM6 citations84
US9685340B2Jun 20, 2017
Stable contact on one-sided gate tie-down structure
IBM17 citations84
US9673101B2Jun 6, 2017
Minimize middle-of-line contact line shorts
IBM4 citations84
US9595592B1Mar 14, 2017
Forming dual contact silicide using metal multi-layer and ion beam mixing
IBM11 citations84
US9577096B2Feb 21, 2017
Salicide formation on replacement metal gate finFet devices
IBM6 citations84
US9576961B2Feb 21, 2017
Semiconductor devices with sidewall spacers of equal thickness
IBM6 citations84
US9553093B1Jan 24, 2017
Spacer for dual epi CMOS devices
IBM10 citations84
US9520500B1Dec 13, 2016
Self heating reduction for analog radio frequency (RF) device
IBM5 citations84
US9502418B2Nov 22, 2016
Semiconductor devices with sidewall spacers of equal thickness
IBM5 citations84
US9461168B1Oct 4, 2016
Channel strain and controlling lateral epitaxial growth of the source and drain in FinFET devices
IBM8 citations84
US9449884B1Sep 20, 2016
Semiconductor device with trench epitaxy and contact
IBM7 citations84
US9362362B2Jun 7, 2016
FinFET with dielectric isolated channel
IBM6 citations84
US7211507B2May 1, 2007
PE-ALD of TaN diffusion barrier region on low-k materials
IBM15 citations84
US6539625B2Apr 1, 2003
Chromium adhesion layer for copper vias in low-k technology
IBM17 citations84
US10049876B1Aug 14, 2018
Removal of trilayer resist without damage to underlying structure
IBM5 citations83
US9443855B1Sep 13, 2016
Spacer formation on semiconductor device
IBM7 citations82
US12329045B2Jun 10, 2025
Phase change memory programming current leakage reduction
IBM2 citations75
US11600325B2Mar 7, 2023
Non volatile resistive memory logic device
IBM2 citations73
US10971585B2Apr 6, 2021
Gate spacer and inner spacer formation for nanosheet transistors having relatively small space between adjacent gates
IBM4 citations73
US10950549B2Mar 16, 2021
ILD gap fill for memory device stack array
IBM2 citations73
US10832941B2Nov 10, 2020
Airgap isolation for backend embedded memory stack pillar arrays
IBM3 citations73
US10833168B2Nov 10, 2020
Complementary metal-oxide-semiconductor (CMOS) nanosheet devices with epitaxial source/drains and replacement metal gate structures
IBM2 citations73
US10777679B2Sep 15, 2020
Removal of work function metal wing to improve device yield in vertical FETs
IBM4 citations73
US10763431B2Sep 1, 2020
Film stress control for memory device stack
IBM3 citations73
INFINEON TECHNOLOGIES AG
3 patentsUS7241696B2Jul 10, 2007
Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
INFINEON TECHNOLOGIES AG20 citations92
US6887783B2May 3, 2005
Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof
INFINEON TECHNOLOGIES AG26 citations92
US6914320B2Jul 5, 2005
Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof
INFINEON TECHNOLOGIES AG13 citations83
GLOBALFOUNDRIES INC
2 patentsSTANDAERT THEODORUS EDUARDUS
1 patentSEO SOON-CHEON
1 patentKELLY JAMES J
1 patentShowing the top 50 of 179 patents by PatentIndex Score.