Inventor
HU CHU-WEI
TW19 patents
⚠️ This page may combine multiple inventors who share the name “HU CHU-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
11 patentsUS6444544B1Sep 3, 2002
Method of forming an aluminum protection guard structure for a copper metal structure
TAIWAN SEMICONDUCTOR MFG76 citations96
US6287926B1Sep 11, 2001
Self aligned channel implant, elevated S/D process by gate electrode damascene
TAIWAN SEMICONDUCTOR MFG36 citations92
US6211069B1Apr 3, 2001
Dual damascene process flow for a deep sub-micron technology
TAIWAN SEMICONDUCTOR MFG37 citations92
US6451679B1Sep 17, 2002
Ion mixing between two-step titanium deposition process for titanium salicide CMOS technology
TAIWAN SEMICONDUCTOR MFG32 citations90
US6169003B1Jan 2, 2001
Method for forming a MOS device with an elevated source and drain, and having a self-aligned channel input
TAIWAN SEMICONDUCTOR MFG20 citations89
US6583017B2Jun 24, 2003
Self aligned channel implant, elevated S/D process by gate electrode damascene
TAIWAN SEMICONDUCTOR MFG8 citations73
US6207538B1Mar 27, 2001
Method for forming n and p wells in a semiconductor substrate using a single masking step
TAIWAN SEMICONDUCTOR MFG14 citations73
US6074905AJun 13, 2000
Formation of a thin oxide protection layer at poly sidewall and area surface
TAIWAN SEMICONDUCTOR MFG11 citations73
US6790756B2Sep 14, 2004
Self aligned channel implant, elevated S/D process by gate electrode damascene
TAIWAN SEMICONDUCTOR MFG2 citations62
US6951803B2Oct 4, 2005
Method to prevent passivation layer peeling in a solder bump formation process
TAIWAN SEMICONDUCTOR MFG3 citations57
US6787470B2Sep 7, 2004
Sacrificial feature for corrosion prevention during CMP
TAIWAN SEMICONDUCTOR MFG0 citations52
MEDIATEK INC
6 patentsUS10418480B2Sep 17, 2019
Semiconductor device capable of high-voltage operation
MEDIATEK INC1 citations60
US9379175B2Jun 28, 2016
Integrated circuits and fabrication methods thereof
MEDIATEK INC1 citations60
US11728320B2Aug 15, 2023
Semiconductor package
MEDIATEK INC0 citations55
US11342316B2May 24, 2022
Semiconductor package
MEDIATEK INC0 citations55
US9793337B2Oct 17, 2017
Integrated circuits and fabrication methods thereof
MEDIATEK INC0 citations50
US9508786B2Nov 29, 2016
Integrated circuits and fabrication methods thereof
MEDIATEK INC0 citations50