P

Inventor

IYER VENKATRAMAN

US102 patents
⚠️ This page may combine multiple inventors who share the name “IYER VENKATRAMAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

34 patents
US10552253B2Feb 4, 2020

Multichip package link error detection

INTEL CORP15 citations94
US9626321B2Apr 18, 2017

High performance interconnect

INTEL CORP14 citations92
US9418035B2Aug 16, 2016

High performance interconnect physical layer

INTEL CORP9 citations92
US9378171B2Jun 28, 2016

High performance interconnect physical layer

INTEL CORP6 citations92
US9355058B2May 31, 2016

High performance interconnect physical layer

INTEL CORP13 citations92
US6359951B1Mar 19, 2002

Method and apparatus for high speed signaling

INTEL CORP20 citations91
US6744810B1Jun 1, 2004

Signal repeater for voltage intolerant components used in a serial data line

INTEL CORP24 citations86
US12197357B2Jan 14, 2025

High performance interconnect

INTEL CORP2 citations85
US10380046B2Aug 13, 2019

High performance interconnect physical layer

INTEL CORP4 citations84
US10216674B2Feb 26, 2019

High performance interconnect physical layer

INTEL CORP7 citations84
US10152446B2Dec 11, 2018

Link-physical layer interface adapter

INTEL CORP10 citations84
US9916266B2Mar 13, 2018

High performance interconnect physical layer

INTEL CORP4 citations84
US9692589B2Jun 27, 2017

Redriver link testing

INTEL CORP14 citations84
US9600431B2Mar 21, 2017

High performance interconnect physical layer

INTEL CORP8 citations84
US9183171B2Nov 10, 2015

Fast deskew when exiting low-power partial-width high speed link state

INTEL CORP9 citations84
US11741030B2Aug 29, 2023

High performance interconnect

INTEL CORP2 citations83
US10747688B2Aug 18, 2020

Low latency retimer

INTEL CORP8 citations83
US10248591B2Apr 2, 2019

High performance interconnect

INTEL CORP5 citations83
US9946676B2Apr 17, 2018

Multichip package link

INTEL CORP8 citations82
US9692402B2Jun 27, 2017

Method, apparatus, system for centering in a high performance interconnect

INTEL CORP10 citations82
US9612986B2Apr 4, 2017

High performance interconnect physical layer

INTEL CORP6 citations82
US11797378B2Oct 24, 2023

Multichip package link error detection

INTEL CORP1 citations73
US11307928B2Apr 19, 2022

Multichip package link error detection

INTEL CORP2 citations73
US11080212B2Aug 3, 2021

High performance interconnect physical layer

INTEL CORP1 citations73
US11061761B2Jul 13, 2021

Multichip package link error detection

INTEL CORP3 citations73
US10963415B2Mar 30, 2021

Bimodal PHY for low latency in high speed interconnects

INTEL CORP1 citations73
US10931329B2Feb 23, 2021

High speed interconnect with channel extension

INTEL CORP4 citations73
US10909055B2Feb 2, 2021

High performance interconnect physical layer

INTEL CORP0 citations73
US10599602B2Mar 24, 2020

Bimodal phy for low latency in high speed interconnects

INTEL CORP3 citations73
US10387339B2Aug 20, 2019

High performance interconnect physical layer

INTEL CORP3 citations73
US10372657B2Aug 6, 2019

Bimodal PHY for low latency in high speed interconnects

INTEL CORP1 citations73
US10050623B2Aug 14, 2018

High performance repeater

INTEL CORP5 citations73
US10002095B2Jun 19, 2018

High performance interconnect physical layer

INTEL CORP2 citations73
US9921768B2Mar 20, 2018

Low power entry in a shared memory link

INTEL CORP4 citations73

ADVANCED MICRO DEVICES INC

7 patents

KLA TENCOR CORP

5 patents

IYER VENKATRAMAN

2 patents

BROWN DAVID L

1 patent

CHERUKURI NAVEEN

1 patent

Showing the top 50 of 102 patents by PatentIndex Score.