Inventor
HUANG KUO-HSIN
TW28 patents
⚠️ This page may combine multiple inventors who share the name “HUANG KUO-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
EXCELLENCE OPTO INC
11 patentsUS10522723B1Dec 31, 2019
Fan-out wafer level light-emitting diode package method and structure thereof
EXCELLENCE OPTO INC2 citations68
US11830862B2Nov 28, 2023
Chip structure of micro light-emitting diode display
EXCELLENCE OPTO INC0 citations57
US12155010B2Nov 26, 2024
Small-size vertical-type light emitting diode chip with high luminous in central region
EXCELLENCE OPTO INC0 citations51
US12062746B2Aug 13, 2024
Small-sized vertical light emitting diode chip with high energy efficiency
EXCELLENCE OPTO INC0 citations51
US11569418B2Jan 31, 2023
Light-emitting diode grain structure with multiple contact points
EXCELLENCE OPTO INC0 citations51
US11469345B2Oct 11, 2022
Vertical light emitting diode structure with high current dispersion and high reliability
EXCELLENCE OPTO INC0 citations51
US12543609B2Feb 3, 2026
Common cathode electrode structure for vertical LED pixel package
EXCELLENCE OPTO INC0 citations50
US11869816B2Jan 9, 2024
LED package with multiple test pads and parallel circuit elements
EXCELLENCE OPTO INC0 citations49
US11869817B2Jan 9, 2024
Vertical light emitting diode chip package with electrical detection position
EXCELLENCE OPTO INC0 citations49
US10096745B1Oct 9, 2018
Light emitting diode capable of generating different light colors over single wafer
EXCELLENCE OPTO INC0 citations47
US11672065B1Jun 6, 2023
Automotive lighting unit for detecting electrical characteristics of light emitter diode component
EXCELLENCE OPTO INC0 citations46
IND TECH RES INST
5 patentsUS9902564B1Feb 27, 2018
Roller assembly, step roller thereof, and method for transporting substrate using the same
IND TECH RES INST4 citations66
US10895007B2Jan 19, 2021
Evaporation apparatus and calibration method thereof
IND TECH RES INST0 citations51
US10308461B2Jun 4, 2019
Roller assembly and method for transporting a substrate using the same
IND TECH RES INST0 citations50
US10100410B2Oct 16, 2018
Film thickness monitoring system and method using the same
IND TECH RES INST0 citations49
US10118255B2Nov 6, 2018
Cutting method of a multilayer structure containing a brittle layer
IND TECH RES INST1 citations48
HEWLETT PACKARD CO
3 patentsUS5233204AAug 3, 1993
Light-emitting diode with a thick transparent layer
HEWLETT PACKARD CO215 citations96
US5344791ASep 6, 1994
Diffusion control of p-n junction location in multilayer heterostructure light emitting devices
HEWLETT PACKARD CO17 citations81
US5164798ANov 17, 1992
Diffusion control of P-N junction location in multilayer heterostructure light emitting devices
HEWLETT PACKARD CO19 citations81