P

Inventor

HSU CHIA-HAO

TW93 patents
⚠️ This page may combine multiple inventors who share the name “HSU CHIA-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

20 patents
US9869934B2Jan 16, 2018

Collector in an extreme ultraviolet lithography system with optimal air curtain protection

TAIWAN SEMICONDUCTOR MFG CO LTD148 citations99
US11145623B2Oct 12, 2021

Integrated circuit packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD23 citations94
US10867954B2Dec 15, 2020

Interconnect chips

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations94
US10720401B2Jul 21, 2020

Interconnect chips

TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US10515888B2Dec 24, 2019

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11978714B2May 7, 2024

Encapsulated package including device dies connected via interconnect die

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11728314B2Aug 15, 2023

Methods of forming integrated circuit packages

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11476184B2Oct 18, 2022

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10515869B1Dec 24, 2019

Semiconductor package structure having a multi-thermal interface material structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9964850B2May 8, 2018

Method to mitigate defect printability for ID pattern

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9618856B2Apr 11, 2017

Method of overlay in extreme ultra-violet (EUV) lithography

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11728238B2Aug 15, 2023

Semiconductor package with heat dissipation films and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11139282B2Oct 5, 2021

Semiconductor package structure and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12261151B2Mar 25, 2025

Integrated circuit packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11086227B2Aug 10, 2021

Method to mitigate defect printability for ID pattern

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9405204B2Aug 2, 2016

Method of overlay in extreme ultra-violet (EUV) lithography

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12564082B2Feb 24, 2026

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334464B2Jun 17, 2025

Encapsulated package including device dies connected via interconnect die

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080638B2Sep 3, 2024

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12062590B2Aug 13, 2024

Method for manufacturing semiconductor package structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62

HSU CHIA-HAO

5 patents

MEDIATEK INC

5 patents

TAIWAN SEMICONDUCTOR MFG

4 patents

DELL PRODUCTS LP

3 patents

IND TECH RES INST

3 patents

HSU CHIA HAO

2 patents

FOXTRON VEHICLE TECH CO LTD

2 patents

JAN CHENG SHIUE

1 patent

WIWYNN CORP

1 patent

UNIVERSAL MICROWAVE TECH INC

1 patent

LITE ON TECHNOLOGY CORP

1 patent

LITE ON IT CORP

1 patent

QISDA CORP

1 patent

Showing the top 50 of 93 patents by PatentIndex Score.