Inventor
HSU CHIA-HAO
TW93 patents
⚠️ This page may combine multiple inventors who share the name “HSU CHIA-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
20 patentsUS9869934B2Jan 16, 2018
Collector in an extreme ultraviolet lithography system with optimal air curtain protection
TAIWAN SEMICONDUCTOR MFG CO LTD148 citations99
US11145623B2Oct 12, 2021
Integrated circuit packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD23 citations94
US10867954B2Dec 15, 2020
Interconnect chips
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations94
US10720401B2Jul 21, 2020
Interconnect chips
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US10515888B2Dec 24, 2019
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11978714B2May 7, 2024
Encapsulated package including device dies connected via interconnect die
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11728314B2Aug 15, 2023
Methods of forming integrated circuit packages
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11476184B2Oct 18, 2022
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10515869B1Dec 24, 2019
Semiconductor package structure having a multi-thermal interface material structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9964850B2May 8, 2018
Method to mitigate defect printability for ID pattern
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9618856B2Apr 11, 2017
Method of overlay in extreme ultra-violet (EUV) lithography
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11728238B2Aug 15, 2023
Semiconductor package with heat dissipation films and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11139282B2Oct 5, 2021
Semiconductor package structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12261151B2Mar 25, 2025
Integrated circuit packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11086227B2Aug 10, 2021
Method to mitigate defect printability for ID pattern
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9405204B2Aug 2, 2016
Method of overlay in extreme ultra-violet (EUV) lithography
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12564082B2Feb 24, 2026
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334464B2Jun 17, 2025
Encapsulated package including device dies connected via interconnect die
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080638B2Sep 3, 2024
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12062590B2Aug 13, 2024
Method for manufacturing semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
HSU CHIA-HAO
5 patentsUS8765582B2Jul 1, 2014
Method for extreme ultraviolet electrostatic chuck with reduced clamp effect
HSU CHIA-HAO93 citations96
US8579900B2Nov 12, 2013
Minimally invasive skeletal fixation device
HSU CHIA-HAO8 citations84
US8251641B2Aug 28, 2012
Stack of fan case
HSU CHIA-HAO8 citations84
US9182936B2Nov 10, 2015
Display device with sharable screen image
HSU CHIA-HAO2 citations63
US8306147B2Nov 6, 2012
4X over-sampling data recovery method and system
HSU CHIA-HAO2 citations63
MEDIATEK INC
5 patentsUS11227846B2Jan 18, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC7 citations84
US11640930B2May 2, 2023
Semiconductor package having liquid-cooling lid
MEDIATEK INC2 citations71
US11302657B2Apr 12, 2022
Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
MEDIATEK INC1 citations71
US11621211B2Apr 4, 2023
Semiconductor package structure
MEDIATEK INC2 citations69
US11908767B2Feb 20, 2024
Semiconductor package structure
MEDIATEK INC0 citations62
TAIWAN SEMICONDUCTOR MFG
4 patentsUS8958237B1Feb 17, 2015
Static random access memory timing tracking circuit
TAIWAN SEMICONDUCTOR MFG28 citations92
US9377693B2Jun 28, 2016
Collector in an extreme ultraviolet lithography system with optimal air curtain protection
TAIWAN SEMICONDUCTOR MFG10 citations84
US9128384B2Sep 8, 2015
Method of forming a pattern
TAIWAN SEMICONDUCTOR MFG9 citations84
US9373552B2Jun 21, 2016
Method of calibrating or exposing a lithography tool
TAIWAN SEMICONDUCTOR MFG2 citations63
DELL PRODUCTS LP
3 patentsIND TECH RES INST
3 patentsUS10444067B2Oct 15, 2019
Optical sensing apparatus and measuring method thereof
IND TECH RES INST14 citations84
US9966804B2May 8, 2018
Outer-rotor permanent magnet brushless motor
IND TECH RES INST4 citations68
US11245293B2Feb 8, 2022
Motor stator with dovetail or rectangular mount structure and stator teeth airgap width ratio
IND TECH RES INST2 citations64
HSU CHIA HAO
2 patentsFOXTRON VEHICLE TECH CO LTD
2 patentsJAN CHENG SHIUE
1 patentWIWYNN CORP
1 patentUNIVERSAL MICROWAVE TECH INC
1 patentLITE ON TECHNOLOGY CORP
1 patentLITE ON IT CORP
1 patentQISDA CORP
1 patentShowing the top 50 of 93 patents by PatentIndex Score.