Inventor

HONG DEBO

CN3 patents

Patents

3 patents

US11485861B2Nov 1, 2022

Method for applying thermally conductive composition on electronic components

DOW SILICONES CORP2 citations67

US11845869B2Dec 19, 2023

Method for producing thixotropic curable silicone composition

DOW SILICONES CORP0 citations49

US12378363B2Aug 5, 2025

Thermal conductive silicone composition

DOW SILICONES CORP0 citations39