Inventor

TAKAHIRA HIDENOBU

JP3 patents

⚠️ This page may combine multiple inventors who share the name “TAKAHIRA HIDENOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJIFILM CORP

1 patent

US7525201B2Apr 28, 2009

Semiconductor chip having solder bumps and dummy bumps

FUJIFILM CORP10 citations77

FUJIFILMCORPORATION

1 patent

US7855136B2Dec 21, 2010

Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps

FUJIFILMCORPORATION6 citations65

OGASAWARA YASUHIRO

1 patent

US9372551B2Jun 21, 2016

Image reading apparatus

OGASAWARA YASUHIRO0 citations38