Inventor · disambiguated record
Jiung Pak
Also filed as: PAK JIUNG
2 granted patents·0 citations·filing 2015–2017
27Inventor score
Technology areasH10P
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0150US10312105B2Semiconductor devices using auxiliary layers for trimming margin and devices so formedSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 4, 2019·0 cites·5 claims
- 0247US9691627B2Methods of forming semiconductor devices using auxiliary layers for trimming marginSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
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