Inventor
FUJII SHINJIRO
JP5 patents
Patents
5 patentsUS9868884B2Jan 16, 2018
Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
HITACHI CHEMICAL CO LTD2 citations65
US10808150B2Oct 20, 2020
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
HITACHI CHEMICAL CO LTD3 citations64
US10947326B2Mar 16, 2021
Adhesive composition, cured article, semiconductor device, and production method for same
HITACHI CHEMICAL CO LTD1 citations55
US10358580B2Jul 23, 2019
Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
HITACHI CHEMICAL CO LTD1 citations55
US9920227B2Mar 20, 2018
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
HITACHI CHEMICAL CO LTD0 citations46