Inventor

LEE JAEHYUN

KR86 patents

⚠️ This page may combine multiple inventors who share the name “LEE JAEHYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE JAEHYUN

SAMSUNG DISPLAY CO LTD

Electronic device

Electronic device

Display device

Display device including a conductive portion covering an area in which clock signal lines and touch signal lines overlap

Display device including a conductive portion covering an area in which clock signal lines and touch signal lines overlap

Electronic device

Method of manufacturing display apparatus and display apparatus manufactured through the method

Pixel and display device including the same

Organic light-emitting device

Display device including a conductive portion covering an area in which clock signal lines and touch signal lines overlap

Electronic device

Display device including electrically connected pad electrodes and manufacturing method thereof

Pixel with transistor for receiving voltage of scan driver Q node

Display device

Display device

Display device

SAMSUNG ELECTRONICS CO LTD

Method and apparatus for transmitting or receiving signals in wireless communication system

Method and apparatus for transmitting and receiving signal in a wireless communication system

Device and method for channel forecast in wireless communication system

Integrated circuit semiconductor device and method of manufacturing the same

Integrated circuit semiconductor device and method of manufacturing the same

Electrostatic chuck assembly and substrate processing apparatus including the same

Method and device for controlling resource and power of full duplex operation in a wireless communication system

Monitoring units, plasma treatment devices including the same, and methods of fabricating semiconductor devices using the same

Method and device for transmitting and receiving signal in wireless communication system

Substrate processing apparatus, substrate processing method, and method of fabricating semiconductor device using the same

Method and apparatus for controlling power output from electronic device to external electronic device in a wireless communication system

Semiconductor device including fin field effect transistor with separation layer

Semiconductor device including fin field effect transistor

HYUNDAI MOTOR CO LTD

Fastening device and control method of the same

Joint guarantee system for vehicle assembly and control method of the same

Joint guarantee system for vehicle assembly and control method of the same

Sensor position control apparatus and method

Sensor position control apparatus and method

Sensor position control apparatus and method

LEE JAEHYUN

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids

Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrate

Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure

Integrated circuit packaging system with film assistance mold and method of manufacture thereof

LINE PLUS CORP

Method, system, and non-transitory computer-readable record medium for sharing content during VoIP-based call

Method, system, and non-transitory computer-readable record medium for displaying reaction during VoIP-based call

Method, system, and non-transitory computer-readable record medium for sharing content during VoIP-based call

Method, system, and non-transitory computer-readable record medium for displaying reaction during VoIP-based call

DONGWOO FINE CHEM CO LTD

Pad electrode part and touch sensor therewith

Rear glass touch sensor

LG CHEMICAL LTD

Cooling member for battery module and battery pack including the same

Titania-carbon nanotube-sulfur (TiO2-x-CNT-S) composite and preparing method therefor

STATS CHIPPAC LTD

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

KIM YOUNGCHUL

Integrated circuit packaging system with connection structure and method of manufacture thereof