Inventor

KAO YIFAN

TW4 patents

Patents

4 patents

US11862597B2Jan 2, 2024

Asymmetric stackup structure for SoC package substrates

APPLE INC2 citations69

US11908819B2Feb 20, 2024

Semiconductor packaging substrate fine pitch metal bump and reinforcement structures

APPLE INC0 citations59

US11545455B2Jan 3, 2023

Semiconductor packaging substrate fine pitch metal bump and reinforcement structures

APPLE INC1 citations59

US12322721B2Jun 3, 2025

Asymmetric Stackup Structure for SoC package substrates

APPLE INC0 citations58