Inventor

RIESKE RALF

DE19 patents

⚠️ This page may combine multiple inventors who share the name “RIESKE RALF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RIESKE RALF

SILTECTRA GMBH

Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack

Method for reducing the thickness of solid-state layers provided with components

Method for thinning solid body layers provided with components

Method for producing wafers with modification lines of defined orientation

Splitting of a solid using conversion of material

Splitting of a solid using conversion of material

Solid body and multi-component arrangement

Production facility for separating wafers from donor substrates

Method for modifying substrates based on crystal lattice dislocation density

Method and device for producing planar modifications in solid bodies

Method for separating wafers from donor substrates

Laser conditioning of solid bodies using prior knowledge from previous machining steps

Method for thinning solid-body layers provided with components

Combined laser treatment of a solid body to be split

Method for producing short subcritical cracks in solid bodies

INFINEON TECHNOLOGIES AG

Method and apparatus for producing at least one modification in a solid body

Method and apparatus for producing at least one modification in a solid body

Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices

FRANKENSTEIN BERND

System for monitoring the condition of rotor blades at wind turbines