Inventor

RICHTER JAN

DE62 patents

⚠️ This page may combine multiple inventors who share the name “RICHTER JAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RICHTER JAN

SILTECTRA GMBH

Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack

Method for producing a detachment area in a solid body

Wafer production method

Combined wafer production method with laser treatment and temperature-induced stresses

Combined wafer production method with laser treatment and temperature-induced stresses

Method for reducing the thickness of solid-state layers provided with components

Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components

Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam

Method for thinning solid body layers provided with components

Method for the material-saving production of wafers and processing of wafers

Method for producing wafers with modification lines of defined orientation

Method for separating a solid body

Splitting of a solid using conversion of material

Nonplanar wafer and method for producing a nonplanar wafer

Method for producing a layer of solid material

Method of treating a solid layer bonded to a carrier substrate

Splitting of a solid using conversion of material

Method for separating thin layers of solid material from a solid body

Laser-based separation method

Method for guiding a crack in the peripheral region of a donor substrate

Solid body and multi-component arrangement

Production facility for separating wafers from donor substrates

Method for modifying substrates based on crystal lattice dislocation density

Method and device for producing planar modifications in solid bodies

Method for forming a crack in an edge region of a donor substrate

Method for separating wafers from donor substrates

Splitting method and use of a material in a splitting method

Combined method for producing solids, involving laser treatment and temperature-induced stresses to generate three-dimensional solids

Laser conditioning of solid bodies using prior knowledge from previous machining steps

Method for thinning solid-body layers provided with components

Combined laser treatment of a solid body to be split

Method for guiding a crack in the peripheral region of a donor substrate

Method for producing short subcritical cracks in solid bodies

3D SYSTEMS INC

Method of making a three-dimensional object by stereolithography

Method of making a three-dimensional object by stereolithography

Method of making a three-dimensional object by stereolithography

Method of making a three-dimensional object by stereolithography

IBM

Drone range extension via host vehicles

System and method for dynamically adjusting an emergency coordination simulation system

Optimal electric vehicle battery recommendation system

Optimal electric vehicle battery recommendation system

SIEMENS AG

Method and apparatus for the start-up operation of a multi-axis system

Method in a computer system, computer program and data processing system

Method for storing and propagating error information in computer programs

PFEIFLE MARTIN

Method and system for handling binary large objects

Virtual table generator for analyzing geographic databases

RICHTER JAN

Incremental testing of a navigation database

Page server for navigation data

Silectra GmbH

Combined production method for separating a number of thin layers of solid material from a thick solid body

INFINEON TECHNOLOGIES AG

Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices