Inventor
SHIEH PI-CHEN
TW4 patents
Patents
4 patentsUS5923088AJul 13, 1999
Bond pad structure for the via plug process
TAIWAN SEMICONDUCTOR MFG96 citations96
US5700735ADec 23, 1997
Method of forming bond pad structure for the via plug process
TAIWAN SEMICONDUCTOR MFG126 citations96
US5547881AAug 20, 1996
Method of forming a resistor for ESD protection in a self aligned silicide process
TAIWAN SEMICONDUCTOR MFG35 citations91
US5712207AJan 27, 1998
Profile improvement of a metal interconnect structure on a tungsten plug
TAIWAN SEMICONDUCTOR MFG14 citations72