Inventor
HUANG WEN-CHING
TW13 patents
⚠️ This page may combine multiple inventors who share the name “HUANG WEN-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NOVATEK MICROELECTRONICS CORP
9 patentsUS10770368B2Sep 8, 2020
Chip on film package and heat-dissipation structure for a chip package
NOVATEK MICROELECTRONICS CORP3 citations71
US10043737B2Aug 7, 2018
Chip on film package
NOVATEK MICROELECTRONICS CORP4 citations71
US10418305B2Sep 17, 2019
Chip on film package
NOVATEK MICROELECTRONICS CORP3 citations68
US11581261B2Feb 14, 2023
Chip on film package
NOVATEK MICROELECTRONICS CORP0 citations60
US10236234B2Mar 19, 2019
Chip on film package
NOVATEK MICROELECTRONICS CORP1 citations58
US10079194B1Sep 18, 2018
Chip on film package
NOVATEK MICROELECTRONICS CORP1 citations48
US11322427B2May 3, 2022
Chip on film package
NOVATEK MICROELECTRONICS CORP0 citations47
US10643921B2May 5, 2020
Chip on film package
NOVATEK MICROELECTRONICS CORP0 citations47
US9960151B2May 1, 2018
Semiconductor device, display panel assembly, semiconductor structure
NOVATEK MICROELECTRONICS CORP1 citations45