Inventor
CHENG CHIH-KAI
TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHENG CHIH-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS11923310B2Mar 5, 2024
Package structure including through via structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11088079B2Aug 10, 2021
Package structure having line connected via portions
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11011451B2May 18, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US12538816B2Jan 27, 2026
Package structure having line connected via portions
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080623B2Sep 3, 2024
Integrated circuit packages having mechanical brace standoffs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US9711478B2Jul 18, 2017
Semiconductor device with an anti-pad peeling structure and associated method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
GLOBALWAFERS CO LTD
4 patentsUS12202017B2Jan 21, 2025
Cleaning tools and methods for cleaning the pull cable of an ingot puller apparatus
GLOBALWAFERS CO LTD4 citations80
US12502696B2Dec 23, 2025
Methods for cleaning the pull cable of an ingot puller apparatus
GLOBALWAFERS CO LTD0 citations57
US12491541B2Dec 9, 2025
Cleaning tools and methods for cleaning the pull cable of an ingot puller apparatus
GLOBALWAFERS CO LTD0 citations57
US12491542B2Dec 9, 2025
Methods for cleaning the pull cable of an ingot puller apparatus
GLOBALWAFERS CO LTD0 citations57