P

Inventor

HECK JOHN

US84 patents
⚠️ This page may combine multiple inventors who share the name “HECK JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

34 patents
US6903452B2Jun 7, 2005

Packaging microelectromechanical structures

INTEL CORP92 citations98
US7183622B2Feb 27, 2007

Module integrating MEMS and passive components

INTEL CORP61 citations97
US6812814B2Nov 2, 2004

Microelectromechanical (MEMS) switching apparatus

INTEL CORP82 citations97
US6713314B2Mar 30, 2004

Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator

INTEL CORP108 citations97
US6852926B2Feb 8, 2005

Packaging microelectromechanical structures

INTEL CORP120 citations96
US6806543B2Oct 19, 2004

Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection

INTEL CORP41 citations96
US6673697B2Jan 6, 2004

Packaging microelectromechanical structures

INTEL CORP49 citations96
US6686820B1Feb 3, 2004

Microelectromechanical (MEMS) switching apparatus

INTEL CORP52 citations95
US10310196B2Jun 4, 2019

Monolithic physically displaceable optical waveguides

INTEL CORP33 citations94
US7368808B2May 6, 2008

MEMS packaging using a non-silicon substrate for encapsulation and interconnection

INTEL CORP60 citations94
US7061099B2Jun 13, 2006

Microelectronic package having chamber sealed by material including one or more intermetallic compounds

INTEL CORP50 citations93
US10281322B2May 7, 2019

Low power, high resolution solid state LIDAR circuit having a modulator to modulate a bit sequence onto a carrier frequency of a received optical signal

INTEL CORP19 citations92
US9823118B2Nov 21, 2017

Low power, high resolution solid state LIDAR circuit

INTEL CORP32 citations92
US7283024B2Oct 16, 2007

MEMS switch stopper bumps with adjustable height

INTEL CORP25 citations92
US6967548B2Nov 22, 2005

Microelectromechanical (MEMS) switching apparatus

INTEL CORP15 citations92
US6943419B2Sep 13, 2005

Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator

INTEL CORP21 citations92
US9575341B2Feb 21, 2017

Solid state LIDAR circuit with waveguides tunable to separate phase offsets

INTEL CORP46 citations91
US7321275B2Jan 22, 2008

Ultra-low voltage capable zipper switch

INTEL CORP30 citations90
US8803268B2Aug 12, 2014

Vertical mirror in a silicon photonic circuit

INTEL CORP6 citations84
US7869334B2Jan 11, 2011

Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperatures

INTEL CORP7 citations84
US7687297B2Mar 30, 2010

Forming a cantilever assembly for vertical and lateral movement

INTEL CORP14 citations84
US9239340B2Jan 19, 2016

Optomechanical sensor for accelerometry and gyroscopy

INTEL CORP10 citations83
US7510907B2Mar 31, 2009

Through-wafer vias and surface metallization for coupling thereto

INTEL CORP11 citations82
US7243833B2Jul 17, 2007

Electrically-isolated interconnects and seal rings in packages using a solder preform

INTEL CORP9 citations74
US11894474B2Feb 6, 2024

Silicon photonic integrated lens compatible with wafer processing

INTEL CORP5 citations73
US11222987B2Jan 11, 2022

Optical receiver employing a metasurface collection lens having concentric belts or rings

INTEL CORP3 citations73
US10466515B2Nov 5, 2019

On-chip optical isolator

INTEL CORP3 citations73
US9897827B1Feb 20, 2018

Feedback controlled closed loop on-chip isolator

INTEL CORP4 citations73
US11175451B2Nov 16, 2021

Mechanisms for refractive index tuning semiconductor photonic devices

INTEL CORP2 citations71
US10914874B2Feb 9, 2021

Metasurface devices for display and photonics devices

INTEL CORP2 citations71
US10564330B2Feb 18, 2020

Metasurface devices for display and photonics devices

INTEL CORP4 citations71
US9778042B2Oct 3, 2017

Opto-mechanical inertial sensor

INTEL CORP2 citations71
US10877352B2Dec 29, 2020

Semiconductor photonic devices using phase change materials

INTEL CORP2 citations69
US12548973B2Feb 10, 2026

Hybrid laser with amorphous bonding layer

INTEL CORP0 citations63

MARS INC

12 patents

HECK JOHN

3 patents

YAMAKAWA MINEO

1 patent

Showing the top 50 of 84 patents by PatentIndex Score.