Inventor

IBRAHIM TAREK A

US24 patents

⚠️ This page may combine multiple inventors who share the name “IBRAHIM TAREK A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBRAHIM TAREK A

INTEL CORP

Microelectronic component having molded regions with through-mold vias

Microelectronic component having molded regions with through-mold vias

Microelectronic component having molded regions with through-mold vias

Photonic interconnect and components in glass

Nested glass packaging architecture for hybrid electrical and optical communication devices

Device, method, and system to provide passivation structures of a magnetic material based inductor

Flexible die to floor planning with bump pitch scale through glass core via pitch

Photonic integrated circuit to glass substrate alignment through integrated cylindrical lens and waveguide structure

Die last and waveguide last architecture for silicon photonic packaging

Photonic integrated circuit packaging architecture

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages

Microelectronic component having molded regions with through-mold vias

Photonic integrated circuit packaging architectures

Stepped coax MIL PTHS for modulating inductance within a package

Integrated MEMS resonator and method

Substrate cavity with stepped walls

Package substrate z-disaggregation with liquid metal interconnects

Die first fan-out architecture for electric and optical integration

Microelectronic structures including glass cores

Microelectronic structures including bridges

Optical circuit with optical port in sidewall

Soldered metallic reservoirs for enhanced transient and steady-state thermal performance

Microelectronic assemblies having integrated magnetic core inductors

TEH WENG HONG

Device, system and method for providing MEMS structures of a semiconductor package