P

Inventor

ECTON JEREMY D

US17 patents

Patents

17 patents
US11081768B2Aug 3, 2021

Fabricating an RF filter on a semiconductor package using selective seeding

INTEL CORP2 citations73
US11670504B2Jun 6, 2023

Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives

INTEL CORP0 citations62
US11605867B2Mar 14, 2023

Fabricating an RF filter on a semiconductor package using selective seeding

INTEL CORP0 citations62
US12523826B2Jan 13, 2026

Photonic integrated circuit to glass substrate alignment through integrated cylindrical lens and waveguide structure

INTEL CORP0 citations61
US12353070B2Jul 8, 2025

Glass interposer optical switching device and method

INTEL CORP0 citations61
US12306480B2May 20, 2025

Glass interposer optical resonator device and method

INTEL CORP0 citations61
US12575427B2Mar 10, 2026

Defect-free through glass via metallization implementing a sacrificial resist thinning material

INTEL CORP0 citations60
US11652071B2May 16, 2023

Electronic device package including a capacitor

INTEL CORP0 citations60
US10923443B2Feb 16, 2021

Electronic device package including a capacitor

INTEL CORP0 citations60
US10910327B2Feb 2, 2021

Electronic device package with reduced thickness variation

INTEL CORP0 citations60
US12543578B2Feb 3, 2026

Electronic packaging architecture with customized variable metal thickness on same buildup layer

INTEL CORP0 citations59
US12354883B2Jul 8, 2025

Omni directional interconnect with magnetic fillers in mold matrix

INTEL CORP0 citations59
US11721631B2Aug 8, 2023

Via structures having tapered profiles for embedded interconnect bridge substrates

INTEL CORP0 citations59
US11373951B2Jun 28, 2022

Via structures having tapered profiles for embedded interconnect bridge substrates

INTEL CORP0 citations59
US12027466B2Jul 2, 2024

Conductive route patterning for electronic substrates

INTEL CORP0 citations51
US11721650B2Aug 8, 2023

Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package

INTEL CORP0 citations49
US10438812B2Oct 8, 2019

Anisotropic etching systems and methods using a photochemically enhanced etchant

INTEL CORP0 citations48