Inventor
BAMNOLKER HANNA
US23 patents
⚠️ This page may combine multiple inventors who share the name “BAMNOLKER HANNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
16 patentsUS10573522B2Feb 25, 2020
Method for preventing line bending during metal fill process
LAM RES CORP38 citations96
US9595470B2Mar 14, 2017
Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor
LAM RES CORP27 citations94
US11355345B2Jun 7, 2022
Method for preventing line bending during metal fill process
LAM RES CORP21 citations93
US10777453B2Sep 15, 2020
Low resistivity films containing molybdenum
LAM RES CORP18 citations93
US10510590B2Dec 17, 2019
Low resistivity films containing molybdenum
LAM RES CORP26 citations93
US9978605B2May 22, 2018
Method of forming low resistivity fluorine free tungsten film without nucleation
LAM RES CORP23 citations93
US11970776B2Apr 30, 2024
Atomic layer deposition of metal films
LAM RES CORP9 citations85
US11549175B2Jan 10, 2023
Method of depositing tungsten and other metals in 3D NAND structures
LAM RES CORP17 citations85
US9953984B2Apr 24, 2018
Tungsten for wordline applications
LAM RES CORP12 citations84
US10546751B2Jan 28, 2020
Forming low resistivity fluorine free tungsten film without nucleation
LAM RES CORP8 citations83
US9589808B2Mar 7, 2017
Method for depositing extremely low resistivity tungsten
LAM RES CORP17 citations83
US12351914B2Jul 8, 2025
Deposition of films using molybdenum precursors
LAM RES CORP2 citations74
US12362188B2Jul 15, 2025
Method for preventing line bending during metal fill process
LAM RES CORP2 citations73
US10214807B2Feb 26, 2019
Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
LAM RES CORP3 citations71
US10529722B2Jan 7, 2020
Tungsten for wordline applications
LAM RES CORP1 citations62
US11225712B2Jan 18, 2022
Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
LAM RES CORP0 citations60
CYPRESS SEMICONDUCTOR CORP
5 patentsUS6004399ADec 21, 1999
Ultra-low particle semiconductor cleaner for removal of particle contamination and residues from surface oxide formation on semiconductor wafers
CYPRESS SEMICONDUCTOR CORP46 citations92
US6794269B1Sep 21, 2004
Method for and structure formed from fabricating a relatively deep isolation structure
CYPRESS SEMICONDUCTOR CORP17 citations82
US7129178B1Oct 31, 2006
Reducing defect formation within an etched semiconductor topography
CYPRESS SEMICONDUCTOR CORP17 citations78
US6756315B1Jun 29, 2004
Method of forming contact openings
CYPRESS SEMICONDUCTOR CORP7 citations74
US6555484B1Apr 29, 2003
Method for controlling the oxidation of implanted silicon
CYPRESS SEMICONDUCTOR CORP10 citations74