Inventor
GOPINATH SANJAY
US33 patents
⚠️ This page may combine multiple inventors who share the name “GOPINATH SANJAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
15 patentsUS10573522B2Feb 25, 2020
Method for preventing line bending during metal fill process
LAM RES CORP38 citations96
US11355345B2Jun 7, 2022
Method for preventing line bending during metal fill process
LAM RES CORP21 citations93
US9349637B2May 24, 2016
Method for void-free cobalt gap fill
LAM RES CORP37 citations92
US11348795B2May 31, 2022
Metal fill process for three-dimensional vertical NAND wordline
LAM RES CORP7 citations86
US9478411B2Oct 25, 2016
Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS
LAM RES CORP7 citations84
US9484251B1Nov 1, 2016
Contact integration for reduced interface and series contact resistance
LAM RES CORP7 citations79
US12362188B2Jul 15, 2025
Method for preventing line bending during metal fill process
LAM RES CORP2 citations73
US9478438B2Oct 25, 2016
Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor
LAM RES CORP5 citations73
US12014928B2Jun 18, 2024
Multi-layer feature fill
LAM RES CORP2 citations71
US12448686B2Oct 21, 2025
Reducing line bending during metal fill process
LAM RES CORP0 citations62
US12237221B2Feb 25, 2025
Nucleation-free tungsten deposition
LAM RES CORP0 citations60
US12203168B2Jan 21, 2025
Metal deposition
LAM RES CORP1 citations60
US12077858B2Sep 3, 2024
Tungsten deposition
LAM RES CORP0 citations57
US12530021B2Jan 20, 2026
Performance predictors for semiconductor-manufacturing processes
LAM RES CORP0 citations47
US12060639B2Aug 13, 2024
Rapid flush purging during atomic layer deposition
LAM RES CORP0 citations47
NOVELLUS SYSTEMS INC
9 patentsUS6848458B1Feb 1, 2005
Apparatus and methods for processing semiconductor substrates using supercritical fluids
NOVELLUS SYSTEMS INC162 citations98
US6550484B1Apr 22, 2003
Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
NOVELLUS SYSTEMS INC91 citations97
US7211509B1May 1, 2007
Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds
NOVELLUS SYSTEMS INC82 citations96
US7503334B1Mar 17, 2009
Apparatus and methods for processing semiconductor substrates using supercritical fluids
NOVELLUS SYSTEMS INC49 citations95
US6951765B1Oct 4, 2005
Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor
NOVELLUS SYSTEMS INC28 citations91
US7041596B1May 9, 2006
Surface treatment using iodine plasma to improve metal deposition
NOVELLUS SYSTEMS INC25 citations89
US9255326B2Feb 9, 2016
Systems and methods for remote plasma atomic layer deposition
NOVELLUS SYSTEMS INC2 citations62
US7279417B1Oct 9, 2007
Use of metallocenes to inhibit copper oxidation during semiconductor processing
NOVELLUS SYSTEMS INC2 citations61
US7456101B1Nov 25, 2008
Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds
NOVELLUS SYSTEMS INC2 citations60
CVC PRODUCTS INC
4 patentsUS6444263B1Sep 3, 2002
Method of chemical-vapor deposition of a material
CVC PRODUCTS INC108 citations98
US6365502B1Apr 2, 2002
Microelectronic interconnect material with adhesion promotion layer and fabrication method
CVC PRODUCTS INC153 citations97
US6645847B2Nov 11, 2003
Microelectronic interconnect material with adhesion promotion layer and fabrication method
CVC PRODUCTS INC47 citations95
US6627995B2Sep 30, 2003
Microelectronic interconnect material with adhesion promotion layer and fabrication method
CVC PRODUCTS INC59 citations95