P

Inventor

LEE WOO-DONG

KR9 patents
⚠️ This page may combine multiple inventors who share the name “LEE WOO-DONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

5 patents
US9245827B2Jan 26, 2016

3D semiconductor device

SAMSUNG ELECTRONICS CO LTD9 citations84
US6812578B2Nov 2, 2004

Semiconductor device bonding pad resistant to stress and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD18 citations84
US9177886B2Nov 3, 2015

Semiconductor package including chip support and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD11 citations82
US7589405B2Sep 15, 2009

Memory cards and method of fabricating the memory cards

SAMSUNG ELECTRONICS CO LTD6 citations62
US9257309B2Feb 9, 2016

Multi-chip package and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations51

KANG UK-SONG

1 patent
US8743582B2Jun 3, 2014

3D semiconductor device

KANG UK-SONG19 citations92

LEE HEE-JIN

1 patent
US8710677B2Apr 29, 2014

Multi-chip package with a supporting member and method of manufacturing the same

LEE HEE-JIN5 citations82

MA KEUM-HEE

1 patent
US8513802B2Aug 20, 2013

Multi-chip package having semiconductor chips of different thicknesses from each other and related device

MA KEUM-HEE14 citations79

(unassigned)

1 patent
US6591789B1Jul 15, 2003

Device to generate heat by spraying liquid at high speed and high pressure

0 citations49