Inventor

LOW MIN WEE

SG2 patents

Patents

2 patents

US7732259B2Jun 8, 2010

Non-leaded semiconductor package and a method to assemble the same

INFINEON TECHNOLOGIES AG6 citations54

US7875968B2Jan 25, 2011

Leadframe, semiconductor package and support lead for bonding with groundwires

INFINEON TECHNOLOGIES AG0 citations30