Inventor
FUNAYA TAKUO
JP35 patents
⚠️ This page may combine multiple inventors who share the name “FUNAYA TAKUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
16 patentsUS9711451B2Jul 18, 2017
Semiconductor device with coils in different wiring layers
RENESAS ELECTRONICS CORP9 citations84
US9502489B2Nov 22, 2016
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP14 citations84
US7911038B2Mar 22, 2011
Wiring board, semiconductor device using wiring board and their manufacturing methods
RENESAS ELECTRONICS CORP7 citations84
US9219108B2Dec 22, 2015
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP4 citations82
US8987861B2Mar 24, 2015
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP8 citations82
US10483199B2Nov 19, 2019
Semiconductor device with coils in different wiring layers
RENESAS ELECTRONICS CORP2 citations73
US9653396B2May 16, 2017
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP3 citations73
US10085425B2Oct 2, 2018
Electronic apparatus and manufacturing method therefor
RENESAS ELECTRONICS CORP2 citations72
US9536828B2Jan 3, 2017
Semiconductor device
RENESAS ELECTRONICS CORP3 citations72
US9818815B2Nov 14, 2017
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP2 citations71
US10128125B2Nov 13, 2018
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP1 citations62
US10062642B2Aug 28, 2018
Semiconductor device with inductively coupled coils
RENESAS ELECTRONICS CORP1 citations62
US12152997B2Nov 26, 2024
Method for predicting reliability of semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US11063009B2Jul 13, 2021
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US9805950B2Oct 31, 2017
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations52
US10157974B2Dec 18, 2018
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations51
NEC CORP
11 patentsUS6798070B2Sep 28, 2004
Electronic device assembly and a method of connecting electronic devices constituting the same
NEC CORP23 citations92
US6576499B2Jun 10, 2003
Electronic device assembly and a method of connecting electronic devices constituting the same
NEC CORP25 citations92
US6078123AJun 20, 2000
Structure and method for mounting a saw device
NEC CORP51 citations92
US6042682AMar 28, 2000
Method of thermocompression bonding a supporting substrate to a semiconductor bare chip
NEC CORP24 citations92
US6313533B1Nov 6, 2001
Function element, substrate for mounting function element thereon, and method of connecting them to each other
NEC CORP22 citations91
US7838779B2Nov 23, 2010
Wiring board, method for manufacturing same, and semiconductor package
NEC CORP16 citations84
US8035217B2Oct 11, 2011
Semiconductor device and method for manufacturing same
NEC CORP9 citations83
US7816782B2Oct 19, 2010
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
NEC CORP4 citations62
US7829199B2Nov 9, 2010
Solder, and mounted components using the same
NEC CORP0 citations52
US6515869B2Feb 4, 2003
Supporting substrate for a semiconductor bare chip
NEC CORP1 citations52
US8043953B2Oct 25, 2011
Semiconductor device including an LSI chip and a method for manufacturing the same
NEC CORP1 citations51