Inventor
KLINK ERICH
DE35 patents
⚠️ This page may combine multiple inventors who share the name “KLINK ERICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
32 patentsUS6218631B1Apr 17, 2001
Structure for reducing cross-talk in VLSI circuits and method of making same using filled channels to minimize cross-talk
IBM88 citations97
US5016087AMay 14, 1991
Integrated circuit package
IBM62 citations94
US6967398B2Nov 22, 2005
Module power distribution network
IBM21 citations92
US6665843B2Dec 16, 2003
Method and system for quantifying the integrity of an on-chip power supply network
IBM20 citations92
US6535075B2Mar 18, 2003
Tunable on-chip capacity
IBM43 citations92
US6424058B1Jul 23, 2002
Testable on-chip capacity
IBM29 citations92
US6043724AMar 28, 2000
Two-stage power noise filter with on and off chip capacitors
IBM23 citations92
US5914533AJun 22, 1999
Multilayer module with thinfilm redistribution area
IBM35 citations92
US5812380ASep 22, 1998
Mesh planes for multilayer module
IBM34 citations92
US5227995AJul 13, 1993
High density semiconductor memory module using split finger lead frame
IBM35 citations92
US5157635AOct 20, 1992
Input signal redriver for semiconductor modules
IBM48 citations92
US5162264ANov 10, 1992
Integrated circuit package
IBM24 citations91
US6442041B2Aug 27, 2002
MCM—MLC technology
IBM33 citations88
US7348667B2Mar 25, 2008
System and method for noise reduction in multi-layer ceramic packages
IBM17 citations80
US7302664B2Nov 27, 2007
System and method for automatic insertion of on-chip decoupling capacitors
IBM9 citations74
US5956563ASep 21, 1999
Method for reducing a transient thermal mismatch
IBM13 citations73
US9581631B2Feb 28, 2017
Determining the current return path integrity in an electric device connected or connectable to a further device
IBM2 citations71
US4330853AMay 18, 1982
Method of and circuit arrangement for reading and/or writing an integrated semiconductor storage with storage cells in MTL (I2 L) technology
IBM8 citations67
US7266788B2Sep 4, 2007
Via/BSM pattern optimization to reduce DC gradients and pin current density on single and multi-chip modules
IBM4 citations62
US4313177AJan 26, 1982
Storage cell simulation for generating a reference voltage for semiconductor stores in mtl technology
IBM3 citations62
US4259730AMar 31, 1981
IIL With partially spaced collars
IBM2 citations62
US6774836B2Aug 10, 2004
Method for delta-noise reduction
IBM3 citations61
US4542309ASep 17, 1985
Phase splitter with integrated latch circuit
IBM7 citations61
US4170017AOct 2, 1979
Highly integrated semiconductor structure providing a diode-resistor circuit configuration
IBM6 citations61
US9304158B2Apr 5, 2016
Determining the current return path integrity in an electric device connected or connectable to a further device
IBM1 citations60
US7355125B2Apr 8, 2008
Printed circuit board and chip module
IBM4 citations60
US4614885ASep 30, 1986
Phase splitter with latch
IBM5 citations60
US7503111B2Mar 17, 2009
Method for increasing wiring channels/density under dense via fields
IBM6 citations57
US6043436AMar 28, 2000
Wiring structure having rotated wiring layers
IBM3 citations56
US6437252B2Aug 20, 2002
Method and structure for reducing power noise
IBM6 citations55
US7742315B2Jun 22, 2010
Circuit on a printed circuit board
IBM1 citations51
US9891256B2Feb 13, 2018
Determining the current return path integrity in an electric device connected or connectable to a further device
IBM0 citations50
FRECH ROLAND
3 patentsUS8222535B2Jul 17, 2012
Noise reducing circuit arrangement
FRECH ROLAND2 citations61
US8248082B2Aug 21, 2012
Method for determining the current return path integrity in an electric device connected or connectable to a further device
FRECH ROLAND3 citations59
US9134364B2Sep 15, 2015
Determining the current return path integrity in an electric device connected or connectable to a further device
FRECH ROLAND3 citations56