Inventor
HASEGAWA EIETSU
JP3 patents
Patents
3 patentsUS4740252AApr 26, 1988
Solder paste for electronic parts
SENJU METAL INDUSTRY CO38 citations90
US6474537B1Nov 5, 2002
Soldering method using a Cu-containing lead-free alloy
SENJU METAL INDUSTRY CO23 citations84
US6705509B2Mar 16, 2004
Method of recovering lead-free solder from printed circuit boards
SENJU METAL INDUSTRY CO11 citations64