Inventor

ZOHNI WAEL

US143 patents

⚠️ This page may combine multiple inventors who share the name “ZOHNI WAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZOHNI WAEL

CRISP RICHARD DEWITT

Stub minimization for wirebond assemblies without windows

Stub minimization using duplicate sets of terminals for wirebond assemblies without windows

Stub minimization for assemblies without wirebonds to package substrate

Stub minimization using duplicate sets of terminals for wirebond assemblies without windows

Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate

Stub minimization for multi-die wirebond assemblies with parallel windows

Stub minimization for wirebond assemblies without windows

Stub minimization for multi-die wirebond assemblies with orthogonal windows

Stub minimization for wirebond assemblies without windows

Stub minimization using duplicate sets of terminals for wirebond assemblies without windows

Stub minimization for assemblies without wirebonds to package substrate

Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate

Stub minimization for assemblies without wirebonds to package substrate

De-skewed multi-die packages

Stub minimization for multi-die wirebond assemblies with parallel windows

Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate

Stub minimization for multi-die wirebond assemblies with orthogonal windows

INVENSAS CORP

Multi-die wirebond packages with elongated windows

Stub minimization using duplicate sets of signal terminals

Stub minimization for multi-die wirebond assemblies with parallel windows

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Bond via array for thermal conductivity

Stub minimization for multi-die wirebond assemblies with parallel windows

Stub minimization with terminal grids offset from center of package

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Embedded wire bond wires

Dies-on-package devices and methods therefor

Package on-package devices with upper RDL of WLPS and methods therefor

Package-on-package devices with same level WLP components and methods therefor

Package-on-package devices with WLP components with dual RDLs for surface mount dies and methods therefor

Enhanced density assembly having microelectronic packages mounted at substantial angle to board

TESSERA INC

Stacked packages

Microelectronic packages and methods therefor

Microelectronic packages having cavities for receiving microelectric elements

Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts

Multiple die in a face down package

Multiple die stacking for two or more die

Off-center solder ball attach assembly

Off-center solder ball attach and methods therefor

Microelectronic assembly having array including passive elements and interconnects

Multiple die face-down stacking for two or more die

HABA BELGACEM

Memory module in a package

Memory module in a package

Multiple die face-down stacking for two or more die

Flip-chip, face-up and face-down wirebond combination package

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Enhanced stacked microelectronic assemblies with central contacts

ZOHNI WAEL

Flip chip assembly and process with sintering material on metal bumps