Inventor
SUBIDO WILLMAR
US15 patents
⚠️ This page may combine multiple inventors who share the name “SUBIDO WILLMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSAS CORP
9 patentsUS9812402B2Nov 7, 2017
Wire bond wires for interference shielding
INVENSAS CORP30 citations97
US10115678B2Oct 30, 2018
Wire bond wires for interference shielding
INVENSAS CORP26 citations94
US10559537B2Feb 11, 2020
Wire bond wires for interference shielding
INVENSAS CORP10 citations92
US9490222B1Nov 8, 2016
Wire bond wires for interference shielding
INVENSAS CORP20 citations92
US10490528B2Nov 26, 2019
Embedded wire bond wires
INVENSAS CORP17 citations85
US10008469B2Jun 26, 2018
Wafer-level packaging using wire bond wires in place of a redistribution layer
INVENSAS CORP4 citations72
US9761554B2Sep 12, 2017
Ball bonding metal wire bond wires to metal pads
INVENSAS CORP0 citations52
US9502372B1Nov 22, 2016
Wafer-level packaging using wire bond wires in place of a redistribution layer
INVENSAS CORP0 citations51
US9530749B2Dec 27, 2016
Coupling of side surface contacts to a circuit platform
INVENSAS CORP0 citations48
TEXAS INSTRUMENTS INC
3 patentsUS6268662B1Jul 31, 2001
Wire bonded flip-chip assembly of semiconductor devices
TEXAS INSTRUMENTS INC154 citations98
US6329722B1Dec 11, 2001
Bonding pads for integrated circuits having copper interconnect metallization
TEXAS INSTRUMENTS INC94 citations97
US6521479B1Feb 18, 2003
Repackaging semiconductor IC devices for failure analysis
TEXAS INSTRUMENTS INC29 citations87