Inventor

GRIVNA GORDON M

US214 patents

⚠️ This page may combine multiple inventors who share the name “GRIVNA GORDON M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GRIVNA GORDON M

SEMICONDUCTOR COMPONENTS IND

Semiconductor die singulation method

Semiconductor die singulation method

Semiconductor die singulation method

Semiconductor die singulation method

Semiconductor device having trench charge compensation regions and method

Semiconductor device edge termination structure

Semiconductor device having deep trench charge compensation regions and method

Multi-channel ESD device and method therefor

Semiconductor device having deep trench charge compensation regions and method

Superjunction semiconductor device structure

Semiconductor device

Singulation method for semiconductor die having a layer of material along one major surface

Method of forming a semiconductor die

Semiconductor device having trench structures and method

Semiconductor device having reduced capacitance to substrate and method

Semiconductor device having regions of low substrate capacitance

Semiconductor device having deep trench charge compensation regions and method

Semiconductor device having sub-surface trench charge compensation regions

Semiconductor device with high frequency parallel plate trench capacitor structure

Method of forming a semiconductor device including trench termination and trench structure therefor

Electronic device including a feature in an opening

Method of forming an insulated gate field effect transistor device having a shield electrode structure

Semiconductor trench structure having a sealing plug and method

Semiconductor component and method of manufacture

SEMICONDUCTOR COMPONENTS IND LLC

Method of reducing residual contamination in singulated semiconductor die

Termination for a stacked-gate super-junction MOSFET

Method of reducing residual contamination in singulated semiconductor die

Method of reducing residual contamination in singulated semiconductor die

Semiconductor device and method for supporting ultra-thin semiconductor die

Method of singulating semiconductor wafer having back layer

Heated carrier substrate semiconductor die singulation method

Electronic die singulation method

GRIVNA GORDON M

Method of forming an insulated gate field effect transistor device having a shield electrode structure

Semiconductor device with enhanced mobility and method

Method of forming an insulated gate field effect transistor device having a shield electrode structure

Method of forming a semiconductor die

Semiconductor trench structure having a sealing plug

MOTOROLA INC

Method and structure for reducing capacitance between interconnect lines

Method of defining a line width

Method for reducing corrosion of a metal surface containing at least aluminum and copper

Method for fabricating trench isolation and trench substrate contact

JOHNSON CHRIS

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

LOECHELT GARY H

Process of forming an electronic device including a vertical conductive structure

Electronic device including a buried insulating layer and a vertical conductive structure extending therethrough and a process of forming the same

SEMICONDUCTOR COMPANENTS IND L

Method of forming an MOS transistor and structure therefor

PLASMA THERM LLC

Method and apparatus for plasma dicing a semi-conductor wafer

SEMICONDUCTOR COMPONENT IND LLC

Electronic device including a via and a conductive structure, a process of forming the same, and an interposer

PARSEY JR JOHN MICHAEL

Processes of forming an electronic device including a feature in a trench

PLASMA-THERM LLC

Method and apparatus for plasma dicing a semi-conductor wafer