Inventor
HIRAKURA HIROAKI
JP6 patents
Patents
6 patentsUS6692793B2Feb 17, 2004
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film
HITACHI CHEMICAL CO LTD16 citations91
US6583198B2Jun 24, 2003
Photo curable resin composition and photosensitive element
HITACHI CHEMICAL CO LTD15 citations91
US6238840B1May 29, 2001
Photosensitive resin composition
HITACHI CHEMICAL CO LTD38 citations91
US6060215AMay 9, 2000
Photosensitive resin composition and application of its photosensitivity
HITACHI CHEMICAL CO LTD22 citations89
US5885723AMar 23, 1999
Bonding film for printed circuit boards
HITACHI CHEMICAL CO LTD12 citations71
US7071243B2Jul 4, 2006
Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film
HITACHI CHEMICAL CO LTD3 citations61