Inventor
IWASE NOBUO
JP22 patents
⚠️ This page may combine multiple inventors who share the name “IWASE NOBUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
18 patentsUS4970571ANov 13, 1990
Bump and method of manufacturing the same
TOSHIBA KK166 citations99
US5008582AApr 16, 1991
Electronic device having a cooling element
TOSHIBA KK162 citations97
US5909058AJun 1, 1999
Semiconductor package and semiconductor mounting part
TOSHIBA KK66 citations96
US5907187AMay 25, 1999
Electronic component and electronic component connecting structure
TOSHIBA KK57 citations96
US4906341AMar 6, 1990
Method of manufacturing semiconductor device and apparatus therefor
TOSHIBA KK104 citations96
US4835344AMay 30, 1989
Electronic component parts and method for manufacturing the same
TOSHIBA KK47 citations95
US4659611AApr 21, 1987
Circuit substrate having high thermal conductivity
TOSHIBA KK64 citations95
US5453991ASep 26, 1995
Integrated circuit device with internal inspection circuitry
TOSHIBA KK49 citations92
US5412160AMay 2, 1995
Circuit board
TOSHIBA KK33 citations92
US5326623AJul 5, 1994
Circuit board
TOSHIBA KK23 citations92
US4963701AOct 16, 1990
Circuit board
TOSHIBA KK45 citations92
US4772985ASep 20, 1988
Thick film capacitor
TOSHIBA KK24 citations82
US4855251AAug 8, 1989
Method of manufacturing electronic parts including transfer of bumps of larger particle sizes
TOSHIBA KK10 citations74
US4797530AJan 10, 1989
Ceramic circuit substrates and methods of manufacturing same
TOSHIBA KK9 citations74
US5622769AApr 22, 1997
Ceramic circuit board having a thermal conductivity substrate
TOSHIBA KK15 citations72
US5041700AAug 20, 1991
Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure
TOSHIBA KK18 citations72
US4919731AApr 24, 1990
Brazing paste
TOSHIBA KK4 citations62
US4916261AApr 10, 1990
Circuit substrate and producing method of the same
TOSHIBA KK5 citations58