Inventor
RICKERL PAUL G
US8 patents
Patents
8 patentsUS5674595AOct 7, 1997
Coverlay for printed circuit boards
IBM66 citations92
US5334487AAug 2, 1994
Method for forming a patterned layer on a substrate
IBM35 citations92
US5427848AJun 27, 1995
Stress balanced composite laminate material
IBM62 citations91
US4911786AMar 27, 1990
Method of etching polyimides and resulting passivation structure
IBM22 citations81
US5156710AOct 20, 1992
Method of laminating polyimide to thin sheet metal
IBM17 citations80
US4883744ANov 28, 1989
Forming a polymide pattern on a substrate
IBM14 citations72
US5306741AApr 26, 1994
Method of laminating polyimide to thin sheet metal
IBM7 citations71
US6843929B1Jan 18, 2005
Accelerated etching of chromium
IBM3 citations61