Inventor
TANG JOHN J
CN4 patents
Patents
4 patentsUS7511359B2Mar 31, 2009
Dual die package with high-speed interconnect
INTEL CORP11 citations81
US7981726B2Jul 19, 2011
Copper plating connection for multi-die stack in substrate package
INTEL CORP0 citations50
US7989916B2Aug 2, 2011
Integrated capacitors in package-level structures, processes of making same, and systems containing same
INTEL CORP0 citations46
US7670919B2Mar 2, 2010
Integrated capacitors in package-level structures, processes of making same, and systems containing same
INTEL CORP0 citations46