Inventor

YUN JA EUN

KR3 patents

⚠️ This page may combine multiple inventors who share the name “YUN JA EUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

1 patent

US7656017B2Feb 2, 2010

Integrated circuit package system with thermo-mechanical interlocking substrates

STATS CHIPPAC LTD14 citations80

YUN JA EUN

1 patent

US8956914B2Feb 17, 2015

Integrated circuit package system with overhang die

YUN JA EUN3 citations53

KO WONJUN

1 patent

US8067275B2Nov 29, 2011

Integrated circuit package system with package integration

KO WONJUN0 citations49