Inventor
YAMAZAKI NOBUTO
JP41 patents
Patents
41 patentsUS5197652AMar 30, 1993
Wire bonding method and apparatus with lead pressing means
SHINKAWA KK56 citations96
US4932584AJun 12, 1990
Method of wire bonding
SHINKAWA KK74 citations94
US6080651AJun 27, 2000
Wire bonding method
SHINKAWA KK22 citations92
US5981371ANov 9, 1999
Bump forming method
SHINKAWA KK25 citations92
US5906308AMay 25, 1999
Capillary for use in a wire bonding apparatus
SHINKAWA KK23 citations92
US5884830AMar 23, 1999
Capillary for a wire bonding apparatus
SHINKAWA KK24 citations92
US5562396AOct 8, 1996
Non-contact type moving table
SHINKAWA KK32 citations92
US5486733AJan 23, 1996
Bonding apparatus
SHINKAWA KK44 citations92
US5439341AAug 8, 1995
Non-contact type moving table
SHINKAWA KK23 citations92
US5323948AJun 28, 1994
Wire clamper
SHINKAWA KK24 citations92
US5156323AOct 20, 1992
Wire bonding method
SHINKAWA KK30 citations92
US5058798AOct 22, 1991
Method for forming bump on semiconductor elements
SHINKAWA KK41 citations92
US5870489AFeb 9, 1999
Ball detection method and apparatus for wire-bonded parts
SHINKAWA KK25 citations91
US4938383AJul 3, 1990
Dispenser apparatus
SHINKAWA KK24 citations90
US4989756AFeb 5, 1991
Dispensing apparatus
SHINKAWA KK52 citations88
US5024367AJun 18, 1991
Wire bonding method
SHINKAWA KK20 citations82
US4913336AApr 3, 1990
Method of tape bonding
SHINKAWA KK19 citations82
US5411195AMay 2, 1995
Bonding apparatus
SHINKAWA KK10 citations74
US5297722AMar 29, 1994
Wire bonding method and apparatus
SHINKAWA KK10 citations74
US5259548ANov 9, 1993
Wire bonding method
SHINKAWA KK11 citations74
US5223063AJun 29, 1993
Method for bonding semiconductor elements to a tab tape
SHINKAWA KK13 citations74
US5192018AMar 9, 1993
Wire bonding method
SHINKAWA KK17 citations74
US5078312AJan 7, 1992
Wire bonding method
SHINKAWA KK11 citations74
US5056217AOct 15, 1991
Method for manufacturing semiconductor elements equipped with leads
SHINKAWA KK8 citations74
US5040293AAug 20, 1991
Bonding method
SHINKAWA KK9 citations74
US5562395AOct 8, 1996
Non-contact type moving table
SHINKAWA KK10 citations73
US5501569AMar 26, 1996
Non-contact type moving table
SHINKAWA KK7 citations73
US5431527AJul 11, 1995
Non-contact type moving table system
SHINKAWA KK8 citations73
US5046654ASep 10, 1991
Ultrasonic wire bonding apparatus
SHINKAWA KK13 citations73
US5485398AJan 16, 1996
Method and apparatus for inspecting bent portions in wire loops
SHINKAWA KK11 citations72
US5275324AJan 4, 1994
Wire bonding apparatus
SHINKAWA KK16 citations71
US5058797AOct 22, 1991
Detection method for wire bonding failures
SHINKAWA KK18 citations69
US4986460AJan 22, 1991
Apparatus for manufacturing semiconductor devices
SHINKAWA KK7 citations68
US4913763AApr 3, 1990
Die bonding apparatus
SHINKAWA KK13 citations68
US5157985AOct 27, 1992
X-Y table for bonding devices
SHINKAWA KK4 citations63
US5137201AAug 11, 1992
Wire bonding method
SHINKAWA KK4 citations63
US5106011AApr 21, 1992
Bump attachment method
SHINKAWA KK2 citations63
US4936944AJun 26, 1990
Wafer supplying apparatus
SHINKAWA KK3 citations62
US6089439AJul 18, 2000
Wire cutting and feeding device for use in wire bonding apparatus
SHINKAWA KK5 citations61
US5123585AJun 23, 1992
Wire bonding method
SHINKAWA KK6 citations61
US4975050ADec 4, 1990
Workpiece heating and feeding device
SHINKAWA KK3 citations60