Inventor
KADO KENICHI
JP3 patents
Patents
3 patentsUS6218281B1Apr 17, 2001
Semiconductor device with flip chip bonding pads and manufacture thereof
FUJITSU LTD162 citations98
US6232147B1May 15, 2001
Method for manufacturing semiconductor device with pad structure
FUJITSU LTD133 citations97
US5969424AOct 19, 1999
Semiconductor device with pad structure
FUJITSU LTD258 citations97