Inventor
BERTRAM MICHAEL J
US7 patents
Patents
7 patentsUS5368217ANov 29, 1994
High force compression flip chip bonding method and system
MICROELECTRONICS & COMPUTER23 citations92
US5283946AFeb 8, 1994
Method and apparatus for forming metal leads
MICROELECTRONICS & COMPUTER21 citations91
US5210936AMay 18, 1993
Method and apparatus for the excise and lead form of TAB devices
MICROELECTRONICS & COMPUTER30 citations91
US4934582AJun 19, 1990
Method and apparatus for removing solder mounted electronic components
MICROELECTRONICS & COMPUTER41 citations91
US5072874ADec 17, 1991
Method and apparatus for using desoldering material
MICROELECTRONICS & COMPUTER56 citations90
US4945954AAug 7, 1990
Method and apparatus for aligning mating form tools
MICROELECTRONICS & COMPUTER45 citations90
US5462217AOct 31, 1995
High force compression flip chip bonding system
MICROELECTRONICS & COMPUTER17 citations81