Inventor

HUANG PIN-CHENG

TW3 patents

⚠️ This page may combine multiple inventors who share the name “HUANG PIN-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

2 patents

US8987012B2Mar 24, 2015

Method of testing a semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48

US9720013B2Aug 1, 2017

Method of fabricating a semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations46

HUANG HUEI-NUAN

1 patent

US8520391B2Aug 27, 2013

Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof

HUANG HUEI-NUAN0 citations38