Inventor

XIE DONGJI

US4 patents

⚠️ This page may combine multiple inventors who share the name “XIE DONGJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NVIDIA CORP

2 patents

US9329227B2May 3, 2016

Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit board

NVIDIA CORP8 citations74

US12249589B2Mar 11, 2025

Apparatus and method for BGA coplanarity and warpage control

NVIDIA CORP0 citations41

XIE DONGJI

1 patent

US8534136B2Sep 17, 2013

Pin soldering for printed circuit board failure testing

XIE DONGJI2 citations46

DU SHOUZHONG ALEX

1 patent

US9283698B2Mar 15, 2016

System and method for preventing warpage of metal components during manufacturing processes

DU SHOUZHONG ALEX0 citations28