Inventor
ISHIHARA MICHIO
JP3 patents
Patents
3 patentsUS4767004AAug 30, 1988
Method of packing electronic parts and a pack produced by the method
FUJITSU LTD29 citations89
US4302070ANov 24, 1981
Optoelectronic semiconductor device having an optical fiber connector
FUJITSU LTD24 citations77
US4297722AOct 27, 1981
Ceramic package for semiconductor devices having metalized lead patterns formed like a floating island
FUJITSU LTD7 citations71