Inventor
TRAN KHANH Q
US11 patents
⚠️ This page may combine multiple inventors who share the name “TRAN KHANH Q”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
9 patentsUS5982035ANov 9, 1999
High integrity borderless vias with protective sidewall spacer
ADVANCED MICRO DEVICES INC34 citations92
US5738917AApr 14, 1998
Process for in-situ deposition of a Ti/TiN/Ti aluminum underlayer
ADVANCED MICRO DEVICES INC36 citations92
US5942801AAug 24, 1999
Borderless vias with HSQ gap filled metal patterns having high etching resistance
ADVANCED MICRO DEVICES INC31 citations91
US6046106AApr 4, 2000
High density plasma oxide gap filled patterned metal layers with improved electromigration resistance
ADVANCED MICRO DEVICES INC18 citations84
US5888911AMar 30, 1999
HSQ processing for reduced dielectric constant
ADVANCED MICRO DEVICES INC11 citations74
US6232223B1May 15, 2001
High integrity borderless vias with protective sidewall spacer
ADVANCED MICRO DEVICES INC12 citations73
US6097090AAug 1, 2000
High integrity vias
ADVANCED MICRO DEVICES INC9 citations73
US5888898AMar 30, 1999
HSQ baking for reduced dielectric constant
ADVANCED MICRO DEVICES INC8 citations72
US6319859B1Nov 20, 2001
Borderless vias with HSQ gap filled metal patterns having high etching resistance
ADVANCED MICRO DEVICES INC4 citations61