Inventor
HSIEH HUI-YING
TW10 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH HUI-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
9 patentsUS10707157B2Jul 7, 2020
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG2 citations69
US11133245B2Sep 28, 2021
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations61
US11127707B2Sep 21, 2021
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US11728252B2Aug 15, 2023
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations59
US11037868B2Jun 15, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US10615105B2Apr 7, 2020
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations49
US8889488B2Nov 18, 2014
Method for manufacturing semiconductor package
ADVANCED SEMICONDUCTOR ENG0 citations49
US10083888B2Sep 25, 2018
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG1 citations47
US12033923B2Jul 9, 2024
Semiconductor package structure having a lead frame and a passive component
ADVANCED SEMICONDUCTOR ENG0 citations44