Inventor
HUMMEL JOHN P
US20 patents
⚠️ This page may combine multiple inventors who share the name “HUMMEL JOHN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS6551924B1Apr 22, 2003
Post metalization chem-mech polishing dielectric etch
IBM248 citations99
US6184121B1Feb 6, 2001
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM369 citations98
US6577011B1Jun 10, 2003
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
IBM86 citations97
US7531367B2May 12, 2009
Utilizing sidewall spacer features to form magnetic tunnel junctions in an integrated circuit
IBM24 citations92
US6933204B2Aug 23, 2005
Method for improved alignment of magnetic tunnel junction elements
IBM21 citations92
US6261951B1Jul 17, 2001
Plasma treatment to enhance inorganic dielectric adhesion to copper
IBM34 citations91
US6221780B1Apr 24, 2001
Dual damascene flowable oxide insulation structure and metallic barrier
IBM27 citations91
US7087438B2Aug 8, 2006
Encapsulation of conductive lines of semiconductor devices
IBM18 citations83
US7608538B2Oct 27, 2009
Formation of vertical devices by electroplating
IBM7 citations74
US7097777B2Aug 29, 2006
Magnetic switching device
IBM9 citations73
US6348736B1Feb 19, 2002
In situ formation of protective layer on silsesquioxane dielectric for dual damascene process
IBM13 citations73
US6329280B1Dec 11, 2001
Interim oxidation of silsesquioxane dielectric for dual damascene process
IBM10 citations73
US6727589B2Apr 27, 2004
Dual damascene flowable oxide insulation structure and metallic barrier
IBM6 citations72
US6593660B2Jul 15, 2003
Plasma treatment to enhance inorganic dielectric adhesion to copper
IBM11 citations72
US7803639B2Sep 28, 2010
Method of forming vertical contacts in integrated circuits
IBM5 citations63
US6479884B2Nov 12, 2002
Interim oxidation of silsesquioxane dielectric for dual damascene process
IBM4 citations62
US5633034AMay 27, 1997
Process for forming a circuit assembly
IBM6 citations61