Inventor · disambiguated record

Mengyang Huang

Also filed as: HUANG MENGYANG

1 granted patent·0 citations·filing 2023–2023

8Inventor score

Technology areasC22B

Files withUNIV HONGHE1

Top patents by PatentIndex Score

1 record

0158US12435388B2Method for co-producing blister copper by enriching germanium and indium from a copper sulfide oreUNIV HONGHE·Filed 2023·Granted Oct 7, 2025·0 cites·5 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →