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Inventor
JUNG YOUNG HY
KR
3 patents
⚠️ This page may combine multiple inventors who share the name “JUNG YOUNG HY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYNIX SEMICONDUCTOR INC
2 patents
US7652362B2
Jan 26, 2010
Semiconductor package stack with through-via connection
HYNIX SEMICONDUCTOR INC
16 citations
77
US8024857B2
Sep 27, 2011
Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same
HYNIX SEMICONDUCTOR INC
3 citations
54
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG
1 patent
US11450587B2
Sep 20, 2022
Heat removal mechanism for stack-based electronic device with process control component and processing components
AT & S AUSTRIA TECH & SYSTEMTECHNIK AG
2 citations
70