Inventor
HA JEONG-O
KR4 patents
Patents
4 patentsUS7541680B2Jun 2, 2009
Semiconductor device package
SAMSUNG ELECTRONICS CO LTD13 citations81
US7723836B2May 25, 2010
Chip stack structure having shielding capability and system-in-package module using the same
SAMSUNG ELECTRONICS CO LTD18 citations74
US7776650B2Aug 17, 2010
Method for fabricating a flip chip system in package
SAMSUNG ELECTRONICS CO LTD0 citations50
US7517723B2Apr 14, 2009
Method for fabricating a flip chip system in package
SAMSUNG ELECTRONICS CO LTD0 citations50