Inventor
ALIYU YAKUB
SG28 patents
⚠️ This page may combine multiple inventors who share the name “ALIYU YAKUB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
26 patentsUS6683002B1Jan 27, 2004
Method to create a copper diffusion deterrent interface
CHARTERED SEMICONDUCTOR MFG71 citations98
US6720204B2Apr 13, 2004
Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding
CHARTERED SEMICONDUCTOR MFG38 citations92
US6475810B1Nov 5, 2002
Method of manufacturing embedded organic stop layer for dual damascene patterning
CHARTERED SEMICONDUCTOR MFG24 citations92
US6429117B1Aug 6, 2002
Method to create copper traps by modifying treatment on the dielectrics surface
CHARTERED SEMICONDUCTOR MFG21 citations92
US6417088B1Jul 9, 2002
Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG44 citations92
US6378759B1Apr 30, 2002
Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG37 citations92
US6340608B1Jan 22, 2002
Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads
CHARTERED SEMICONDUCTOR MFG21 citations92
US6540841B1Apr 1, 2003
Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
CHARTERED SEMICONDUCTOR MFG13 citations84
US6350689B1Feb 26, 2002
Method to remove copper contamination by using downstream oxygen and chelating agent plasma
CHARTERED SEMICONDUCTOR MFG15 citations84
US6967162B2Nov 22, 2005
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
CHARTERED SEMICONDUCTOR MFG4 citations74
US6705512B2Mar 16, 2004
Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding
CHARTERED SEMICONDUCTOR MFG10 citations74
US6415973B1Jul 9, 2002
Method of application of copper solution in flip-chip, COB, and micrometal bonding
CHARTERED SEMICONDUCTOR MFG9 citations74
US6365508B1Apr 2, 2002
Process without post-etch cleaning-converting polymer and by-products into an inert layer
CHARTERED SEMICONDUCTOR MFG11 citations74
US6309982B1Oct 30, 2001
Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent
CHARTERED SEMICONDUCTOR MFG6 citations74
US6261955B1Jul 17, 2001
Application of vapor phase HFACAC-based compound for use in copper decontamination and cleaning processes
CHARTERED SEMICONDUCTOR MFG6 citations74
US6987321B2Jan 17, 2006
Copper diffusion deterrent interface
CHARTERED SEMICONDUCTOR MFG7 citations72
US6277691B1Aug 21, 2001
Method to fabricate a robust and reliable memory device
CHARTERED SEMICONDUCTOR MFG8 citations66
US6821888B2Nov 23, 2004
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
CHARTERED SEMICONDUCTOR MFG2 citations63
US6813796B2Nov 9, 2004
Apparatus and methods to clean copper contamination on wafer edge
CHARTERED SEMICONDUCTOR MFG4 citations63
US6692579B2Feb 17, 2004
Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence
CHARTERED SEMICONDUCTOR MFG5 citations63
US6358821B1Mar 19, 2002
Method of copper transport prevention by a sputtered gettering layer on backside of wafer
CHARTERED SEMICONDUCTOR MFG5 citations63
US6803305B2Oct 12, 2004
Method for forming a via in a damascene process
CHARTERED SEMICONDUCTOR MFG4 citations60
US6391783B1May 21, 2002
Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique
CHARTERED SEMICONDUCTOR MFG6 citations60
US6686279B2Feb 3, 2004
Method for reducing gouging during via formation
CHARTERED SEMICONDUCTOR MFG4 citations58
US7452808B2Nov 18, 2008
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
CHARTERED SEMICONDUCTOR MFG0 citations52
US7060613B2Jun 13, 2006
Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
CHARTERED SEMICONDUCTOR MFG0 citations50